Fig. 1. Schematic diagram of energy level structure of Nd:YAG crystal^[18]

Fig. 2. Absorption behavior of diamond and graphite ^[21]

Fig. 3. Microscopic morphology of non-bond end-face grinding wheel with conical abrasive array structure^[24]

Fig. 4. (a) Effect of pulse duration on diamond ablation threshold; (b) Incubation effect^[25]

Fig. 5. Effect of plating different absorption layers on the transmittance of processed diamond ^[31]

Fig. 6. Fluorescence image of NV color center array^[33]

Fig. 7. Scanning electron microscope images of diamond surface irradiated by 800 nm femtosecond laser. (a) 170 nm periodic structure formed at 3000 pulse laser energy density of 1.9 J/cm²; (b) 190 nm periodic structure formed at 8000 pulse laser energy density of 2.8 J/cm^2[36]

Fig. 8. With the increase of pulse time delay, the evolution of diamond surface morphology array^[37]

Fig. 9. Interaction model between laser, electron and lattice^[23]. (a) Nanosecond laser; (b) Femtosecond laser

Fig. 10. FIB cross sections of PCD composites obtained by: (a) Lapping; (b) Wire EDM; (c) Laser when pulse width =10 ps; (d) Laser when pulse width =125 ns; (e) Laser when pulse width =450 μs

Fig. 11. Heat conduction and temperature distribution in the single crystal diamond at different scanning time, in which the arrowheads indicate the conductive heat flux direction^[45]

Fig. 12. Raman spectral images of machined pits under different laser fluxes

Fig. 13. Raman spectra of picosecond laser ablation of diamond micro-grooves at different laser energies

Fig. 14. (a) Schematic diagram of ps laser processing; (b) Optical picture of graphitized microstructure device; (c) Influence of orientation on machining morphology and machining threshold^[52-53]

Fig. 15. Scanning electron microscope images of single crystal diamond surface processed by 200 fs laser. (a) Curved structure processed by laser pulse energy of 1.2 mJ; (b) The machined surface image when the laser pulse energy is 840 nJ; (c) An enlarged image of figure (b)^[59]

Fig. 16. Surface morphology of laser processing. (a) Nanosecond laser; (b) Femtosecond lasers^[60]

Fig. 17. Machining diamond through holes on silicon ball substrate by double pulse laser machining surface morpholog^[68]

Fig. 18. The average aspect ratio obtained in diamond is 40∶1^[69]

Fig. 19. Diamond microgrooves processed by process optimization parameters. (a) Surface morphology; (b) Cross-sectional morphology^[26]

Fig. 20. Photos of manifold diamond microchannel^[75]

Fig. 21. Schematic diagram of laser ablation^[79]

Fig. 22. Surface roughness of diamond with different scanning ranges. (a) 100 μm×100 μm; (b)10 μm×10 μm^[85]

Fig. 23. The cross section SEM image of diamond sample after fs-laser treatment^[87]

Fig. 24. CO₂ laser/water-guided laser hybrid machining system^[88]

Fig. 25. Scanning electron microscope images of the ablation made with laser in silicon without. (a) And with water spray; (b) Both are made using 1000 pulses with 2.2 J energy per hole^[93]