Journal of Semiconductors, Volume. 44, Issue 6, 060301(2023)
Heterogeneous integration technology for the thermal management of Ga2O3 power devices
Fig. 1. (Color online) The process flow for transferring β-Ga2O3 thin film onto SiC (or Si) by ion-cutting. Reprinted from Xu et al.[4]. Copyright 2021, with permission from IEEE.
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Genquan Han, Tiangui You, Yibo Wang, Zheng-Dong Luo, Xin Ou, Yue Hao. Heterogeneous integration technology for the thermal management of Ga2O3 power devices[J]. Journal of Semiconductors, 2023, 44(6): 060301
Category: Articles
Received: May. 22, 2023
Accepted: --
Published Online: Jul. 6, 2023
The Author Email: Han Genquan (gqhan@xidian.edu.cn)