Journal of Semiconductors, Volume. 44, Issue 6, 060301(2023)

Heterogeneous integration technology for the thermal management of Ga2O3 power devices

Genquan Han1、*, Tiangui You2, Yibo Wang3, Zheng-Dong Luo1, Xin Ou2, and Yue Hao1
Author Affiliations
  • 1School of Microelectronics, Xidian University, Xi’an 710071, China
  • 2State Key Laboratory of Functional Materials for Informatics, Shanghai Institute of Microsystem and Information Technology, Chinese Academy of Sciences, Shanghai 200050, China
  • 3Suzhou institute of Nano-Tech and Nano-Bionics, Chinese Academy of Sciences, Suzhou 215123, China
  • show less
    Figures & Tables(3)
    (Color online) The process flow for transferring β-Ga2O3 thin film onto SiC (or Si) by ion-cutting. Reprinted from Xu et al.[4]. Copyright 2021, with permission from IEEE.
    (Color online) Benchmarking the measured μeff of GaOSiC MOSFETs against the reported Hall mobility and μeff of bulk β-Ga2O3 materials and devices (data from Ref. [7] and references therein). Reprinted from Wang et al.[7]. Copyright 2021, with permission from IEEE.
    (Color online) Benchmarking RON,sp versus Vbr for the heterogeneous GaOSiC MOSFETs with the reported β-Ga2O3 transistors (data from Ref. [10] and references therein). Reprinted from Wang et al.[10]. Copyright 2022, with permission from IEEE.
    Tools

    Get Citation

    Copy Citation Text

    Genquan Han, Tiangui You, Yibo Wang, Zheng-Dong Luo, Xin Ou, Yue Hao. Heterogeneous integration technology for the thermal management of Ga2O3 power devices[J]. Journal of Semiconductors, 2023, 44(6): 060301

    Download Citation

    EndNote(RIS)BibTexPlain Text
    Save article for my favorites
    Paper Information

    Category: Articles

    Received: May. 22, 2023

    Accepted: --

    Published Online: Jul. 6, 2023

    The Author Email: Han Genquan (gqhan@xidian.edu.cn)

    DOI:10.1088/1674-4926/44/6/060301

    Topics