[1] [1] ZezeD A ,ForrestRD ,CareyJD ,etal. Reactiveion etching of quartz and pyrex for microelectronic applications[J] . J. Appl. Phys. ,2002 ,92: 3624-3629.

[2] [2] EsashiM ,Takinami M ,Wakabayashi Y ,et al. High-rate directional deep dry etching for bulk silicon micromachining [J] . J. Micromech. Microeng. ,1995 ,5(1) : 5-10.

[3] [3] Mohamed K ,AlkaisiM M ,BlaikieR J. Fabrication of three dimensional structures for an UV curable nanoimprint lithography mold using variable dose control with critical- energy electron beam exposure[J] . J. Vac. Sci. Technol. B ,2007 ,25(6) : 2357-2360.

[4] [4] Wang S ,Zhou C ,Ru H ,et al. Optimized condition for etching fused-silica phase gratings with inductively coupled plasma technology[J] . Appl. Opt. ,2005 ,44(21) : 4429-4434.

[5] [5] UjiieT ,Kikuchi T ,Ichiki T ,et al. Fabrication of quartz microcapillary electrophoresis chips using plasma etching[J] . Jpn. J. Appl. Phys. ,2000 ,39(62) : 3677-3682.

[6] [6] TathagataR ,Haixin Z ,Deirdre R M. Deep reactive ion etching offused silica using a single-coated softmask layerfor bio-analytical applications[ J] . J. Micromech. Microeng. ,2010 ,20(9) : 097002.

[7] [7] RabeJ ,Buttgenbach S ,Schroder J ,et al. Monolithic miniaturized quartz microbalance array and its application to chemicalsensorsystemsforliquids[J] . IEEE Sens. J. ,2003 ,3(4) : 361-368.

[8] [8] Park J H ,Lee N E ,Lee J ,et al. Deep dry etching of borosilicate glass using SF6 and SF6/Ar inductively coupled plasmas[J] . Microelecron. Eng. ,2005 ,82(2) : 119-128.

[9] [9] Ok SJ ,Kim C ,Baldwin DF. Highdensity ,high aspectratio through-waferelectricalinterconnectviasforMEMSpackaging[J] . IEEE Trans. on Advanced Packaging ,2003 ,26(3) : 302-309.

[10] [10] AbeT ,Esashi M. One-chip multichannel quartz crystal microbalance ( QCM) fabricated by deep RIE [J] . Sens. Actuators A ,2000 ,82(1/3) : 139-143.

[11] [11] LilienthalK ,Stubenrauch M ,Fischer M ,et al. Fused silica ‘glass grass’: fabrication and utilization[J] . J. Micromech. Microeng. ,2010 ,20(2) : 025017.

[12] [12] AkashiT ,Yoshimura Y. Deep reactive ion etching of borosilicate “glass using”an anodically bonded silicon wafer as an etching mask[J] . J. Micromech. Microeng. ,2006 ,16: 1051-1056.

[13] [13] MorikawaY ,KoidesawaT ,HayashiT ,etal. A noveldeep etching technology forSiand quartz materials[J] . Thin Solid Films ,2007 ,515(12) : 4918-4922.

[14] [14] Zhu H ,HollM ,Ray T ,et al. Characterization of deep wet etching offused silica glass for single cell and optical sensor deposition[J] . J. Micromech. Microeng. ,2009 ,19( 6) :065013.

[15] [15] Kurmoo Y ,Hook A L ,Harvey D ,et al. Real time monitoring ofbiofilm formation on coated medicaldevices for the reduction and interception of bacterial infections[J] . Biomaterials Science ,2020 ,8(5) : 1464-1477.

[16] [16] ArduiS ,Ameur A ,Vermeesch J R ,et al. Single molecule real-time(SMRT) sequencing comes of age: applications and utilities for medicaldiagnostics[J] . Nucleic Acids Research ,2018 ,46(5) : 2159-2168.

[17] [17] Kim SH. TIRF-based single-molecule detection of the reca presynaptic filamentdynamics[J] . Methods in Enzymology ,2018 ,600: 233-253.

[22] [22] Lin LC ,Jing X M ,Wang Q D ,etal. Investigation offused silica glass etching using C4F8/Ar inductively coupled plasmas for through glass via ( TGV) applications[ J] . MicrosystTechnol. ,2016 ,22: 119-127.

[23] [23] MetwalliE ,Pantano C G. Reactive ion etching of glasses: composition dependence[J] . Nucl. Instrum. Meth. Phys. Res. B ,2003 ,207(1) : 21-27.

[24] [24] GoyalA ,Hood V ,Tadigadapa S. High-speed anisotropic etching ofquartz using SF6/C4F8/Ar/O2 based chemistry in inductively coupled plasma reactive ion etching system[J] . Proc. SPIE ,2006 ,6111: 61110.

[25] [25] Bliznetsov V ,LiB ,Lee J W ,et al. MEMS industry-worth etching to fabricate tapered structures in SiO2 [J] . J. of MicroelectromechanicalSystems ,2017 ,26(6) : 1400-1407.