Optics and Precision Engineering, Volume. 32, Issue 9, 1360(2024)

Mechanism for laser-induced damage bad chip of Micro-LED and optimization of processing parameters

Jian QIAO1...3, Zhenduo WU1, Xinhan PENG2, Yuxuan RAN1 and Jingwei YANG1,* |Show fewer author(s)
Author Affiliations
  • 1Guangdong Provincial Key Laboratory of Industrial Intelligent Inspection Technology, Foshan University,Foshan528000,China
  • 2Shenzhen Hymson Laser Intelligent Equipments Co.,Ltd., Shenzhen518000, China
  • 3Ji Hua Laboratory, Foshan528200, China
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    Figures & Tables(14)
    Material structure of GAN-based Micro-LED sample
    Schematic diagram of femtosecond laser processing system
    Schematic diagram of two scan paths
    Squared diameters of ablated regions correlated with applied laser fluence
    Simulation results of vaporization temperature
    Simulation results of monopulse laser ablation
    Results of experimental and simulation ablated depth
    Comparison of surface topography of two scanning paths
    Surface morphology of chip ablated under different laser spot spacing
    Surface roughness of chip under different spacings
    Results of experimental and simulated ablative depth
    Three-dimensional morphology after removing chip
    • Table 1. Main technical parameters of laser processing

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      Table 1. Main technical parameters of laser processing

      ParameterValue
      Wavelength/nm355
      Power/W<10
      Pulse width/fs300
      Frequency/kHz250~5 000
      Optical quality/M21.3
      Spot roundness0.957
    • Table 2. Experimental parameters of laser-induced damage bad chip

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      Table 2. Experimental parameters of laser-induced damage bad chip

      Sample No.Fluence/(J·cm-2Predicted ablation depth/μmScan timesProcessing time/s
      11.320.60101.36
      21.510.6791.21
      31.930.7581.06
      42.520.8670.91
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    Jian QIAO, Zhenduo WU, Xinhan PENG, Yuxuan RAN, Jingwei YANG. Mechanism for laser-induced damage bad chip of Micro-LED and optimization of processing parameters[J]. Optics and Precision Engineering, 2024, 32(9): 1360

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    Paper Information

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    Received: Feb. 2, 2024

    Accepted: --

    Published Online: Jun. 2, 2024

    The Author Email: YANG Jingwei (mejwyang@fosu.edu.cn)

    DOI:10.37188/OPE.20243209.1360

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