To improve the manufacturing quality of Micro-LED display panels, it is crucial to perform in-situ removal and repair of defective chips. This study introduces a laser two-temperature ablation model developed with COMSOL to explore the mechanisms and process parameters for eliminating defective chips using a laser. Initially, the ablation threshold of the Micro-LED was identified by measuring the square diameter of the surface spot created by a single-pulse laser ablation. A fitting analysis was then carried out to determine the relationship between laser parameters and ablation depth, confirming the accuracy of the two-temperature ablation model. An extensive analysis was also conducted to examine the laser spot overlap rate, laser fluence, ablation characteristics, and removal mechanisms for different scanning paths on the affected chips. Utilizing the two-temperature ablation model, the laser scanning path and process parameters were optimized. The findings reveal that the femtosecond laser ablation model for Micro-LED has a maximum analytical error of 9.28%. The optimized laser removal method allows for rapid and precise removal at a rate of 1 s/chip, while ensuring high-quality repair of pad surfaces. This provides essential guidance for efficient repair processes in large-scale production environments of large-format Micro⁃LED display panels.