Optics and Precision Engineering, Volume. 31, Issue 3, 301(2023)
Measurement of through silicon via by near-infrared micro interferometry based on aberration compensation
Fig. 1. Optical path of Linnik near-infrared reflective micro interferometry system
Fig. 2. Modeling of TSV array hole with diameter of 10 μm and depth of 65 μm
Fig. 3. Electric field transmission diagram of probe light focused on points
Fig. 5. Zernike polynomial fitting coefficients of aberration of points
Fig. 7. Interferogram of top and bottom before aberration compensation
Fig. 8. Image evaluation function with 20 iterations of compensation
Fig. 10. Interferograms of top and bottom after aberration compensation
Fig. 11. Interference signal intensity at one point on bottom before aberration compensation
Fig. 12. Interference signal intensity at one point on bottom surface after aberration compensation
Fig. 14. Top and bottom interference patterns of 3.85∶1 aspect-ratio TSV with two methods
Fig. 15. Results of TSV with aspect ratio of 10.3∶1 by near-infrared micro interferometry based on aberration compensation
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Chunxia WU, Jianqiu MA, Zhishan GAO, Zhenyan GUO, Qun YUAN. Measurement of through silicon via by near-infrared micro interferometry based on aberration compensation[J]. Optics and Precision Engineering, 2023, 31(3): 301
Category: Modern Applied Optics
Received: Sep. 8, 2022
Accepted: --
Published Online: Mar. 7, 2023
The Author Email: GUO Zhenyan (guozy15@njust.edu.cn)