Optics and Precision Engineering, Volume. 31, Issue 3, 301(2023)

Measurement of through silicon via by near-infrared micro interferometry based on aberration compensation

Chunxia WU... Jianqiu MA, Zhishan GAO, Zhenyan GUO* and Qun YUAN |Show fewer author(s)
Author Affiliations
  • School of Electronic and Optical Engineering, Nanjing University of Science and Technology, Nanjing210094, China
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    Figures & Tables(16)
    Optical path of Linnik near-infrared reflective micro interferometry system
    Modeling of TSV array hole with diameter of 10 μm and depth of 65 μm
    Electric field transmission diagram of probe light focused on points A and B
    Wavefront phase of points A and B
    Zernike polynomial fitting coefficients of aberration of points A and B
    Linnik near-infrared micro interferometry system
    Interferogram of top and bottom before aberration compensation
    Image evaluation function with 20 iterations of compensation
    Bottom image at 12 times of iterative compensation
    Interferograms of top and bottom after aberration compensation
    Interference signal intensity at one point on bottom before aberration compensation
    Interference signal intensity at one point on bottom surface after aberration compensation
    Results of TSV measurement by different methods
    Top and bottom interference patterns of 3.85∶1 aspect-ratio TSV with two methods
    Results of TSV with aspect ratio of 10.3∶1 by near-infrared micro interferometry based on aberration compensation
    • Table 1. Ten measurements of depth of one hole in TSV using near-infrared micro interferometry

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      Table 1. Ten measurements of depth of one hole in TSV using near-infrared micro interferometry

      NumberResult
      165.97 μm
      267.06 μm
      366.64 μm
      465.33 μm
      566.44 μm
      665.73 μm
      765.78 μm
      865.39 μm
      966.07 μm
      1066.20 μm
      Mean value65.95 μm
      Standard deviation0.42 μm
      Absolute error0.68 μm
      Relative error1%
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    Chunxia WU, Jianqiu MA, Zhishan GAO, Zhenyan GUO, Qun YUAN. Measurement of through silicon via by near-infrared micro interferometry based on aberration compensation[J]. Optics and Precision Engineering, 2023, 31(3): 301

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    Paper Information

    Category: Modern Applied Optics

    Received: Sep. 8, 2022

    Accepted: --

    Published Online: Mar. 7, 2023

    The Author Email: GUO Zhenyan (guozy15@njust.edu.cn)

    DOI:10.37188/OPE.20233103.0301

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