Optics and Precision Engineering, Volume. 28, Issue 8, 1715(2020)

Characterization of thermal mismatch stress of micro-inertial devices based on silicon-glass bonding process

LIU Meng-xia1,*... QIN Qiang1, DONG Xian-shan2, CUI Jian1 and ZHAO Qian-cheng1 |Show fewer author(s)
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    LIU Meng-xia, QIN Qiang, DONG Xian-shan, CUI Jian, ZHAO Qian-cheng. Characterization of thermal mismatch stress of micro-inertial devices based on silicon-glass bonding process[J]. Optics and Precision Engineering, 2020, 28(8): 1715

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    Paper Information

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    Received: Jan. 5, 2020

    Accepted: --

    Published Online: Nov. 2, 2020

    The Author Email: Meng-xia LIU (m.liu@pku.edu.cn)

    DOI:10.3788/ope.20202808.1715

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