Optics and Precision Engineering, Volume. 28, Issue 8, 1715(2020)
Characterization of thermal mismatch stress of micro-inertial devices based on silicon-glass bonding process
Figures & Tables(0)
Tools
Get Citation
Copy Citation Text
LIU Meng-xia, QIN Qiang, DONG Xian-shan, CUI Jian, ZHAO Qian-cheng. Characterization of thermal mismatch stress of micro-inertial devices based on silicon-glass bonding process[J]. Optics and Precision Engineering, 2020, 28(8): 1715
Paper Information
Category:
Received: Jan. 5, 2020
Accepted: --
Published Online: Nov. 2, 2020
The Author Email: Meng-xia LIU (m.liu@pku.edu.cn)
© Copyright 2018-2021 | Chinese Laser Press.
All Rights Reserved 沪ICP备15018463号-20