Optics and Precision Engineering, Volume. 17, Issue 1, 166(2009)

Application of ultrasonic technology to wet etching of silicon

ZENG Yi-bo1,*... WANG Ling-yun2, GU Dan-dan1 and SUN Dao-heng2 |Show fewer author(s)
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  • 1[in Chinese]
  • 2[in Chinese]
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    References(8)

    [3] [3] JING C, LI T L, ZHI J L, et al.. Study of anisotropic etching of (1 0 0) Si with ultrasonic agitation [J]. Sensors and Actuators A, 2002, 96: 152-156.

    [4] [4] CHII R Y, PO Y C, YUANG C C, et al.. Effects of mechanical agitation and surfactant additive on silicon anisotropic etching in alkaline KOH solution [J]. Sensors and Actuators A, 2005, 119: 263-270.

    [5] [5] THEO B, DAVID J S. AFM study of surface finish improvement by ultrasound in the anisotropic etching of Si in KOH for micromachining applications[J]. Micromech. Microeng., 1997, 7: 338-342.

    [6] [6] LIU Y L, TAN B M, ZHANG K L. Micro-electronic Technology Engineering——Material, Process and Testing[M]. Bejing: Publishing House of Electronics Industry, 2004.(in Chinese)

    [7] [7] WANG F SH, TAN J B. Methods of high resolution optical measurement for surface profile [J]. Opt. Precision Eng., 2000, 8(4): 309-315. (in Chinese)

    [8] [8] CAO F G. Ultrasonic Machining Technology[M]. Bejing: Chemical industry Press, 2005.(in Chinese)

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    ZENG Yi-bo, WANG Ling-yun, GU Dan-dan, SUN Dao-heng. Application of ultrasonic technology to wet etching of silicon[J]. Optics and Precision Engineering, 2009, 17(1): 166

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    Paper Information

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    Received: Mar. 26, 2008

    Accepted: --

    Published Online: Oct. 9, 2009

    The Author Email: Yi-bo ZENG (zyb2005@xmu.edu.cn)

    DOI:

    CSTR:32186.14.

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