Journals Articles Conferences News About CLP
Submit a paper Email Alert
Search
Search
Articles
Journals
News
Advanced Search
Top Searches
2D MaterialsTransformation opticsQuantum PhotonicsSmall lasersSemiconductor UV PhotonicsSupersymmetric microring laser arrays

Laser & Optoelectronics Progress, Volume. 54, Issue 9, 91407(2017)

Study on 532-nm Flattened Laser Beam for Silicon Wafer Grooving

Li Haiou1、*, Wei Chunrong1, Wang Xiaofeng2,3, Zhang Zichen2,4, and Pan Lingfeng2
Author Affiliations
  • 1[in Chinese]
  • 2[in Chinese]
  • 3[in Chinese]
  • 4[in Chinese]
    • show less
    AbstractGet PDF(in Chinese)
    Figures&Tables (0)
    Equations (0)
    References (18)
    Tools
    Paper Information
    Topics
    Figures & Tables(0)
    Tools

    Get Citation

    Copy Citation Text

    Li Haiou, Wei Chunrong, Wang Xiaofeng, Zhang Zichen, Pan Lingfeng. Study on 532-nm Flattened Laser Beam for Silicon Wafer Grooving[J]. Laser & Optoelectronics Progress, 2017, 54(9): 91407

    Download Citation

    EndNote(RIS)BibTexPlain Text
    Set citation alerts for article
    Save article for my favorites
    Paper Information

    Category: Lasers and Laser Optics

    Received: Mar. 23, 2017

    Accepted: --

    Published Online: Sep. 6, 2017

    The Author Email: Haiou Li (seagull_1228@hotmail.com)

    DOI:10.3788/lop54.091407

    Topics

    laser devices and laser physics
    Lasers and Laser Optics
    Laser physics
    laser manufacturing
    Instrumentation, Measurement and Metrology