Piezoelectrics & Acoustooptics, Volume. 42, Issue 1, 47(2020)

Wireless Bonding Package Based on Low Temperature Co-fired Ceramics

JIAO Jingjing1,*... SHI Yunbo1, ZHAO Yongqi1, ZHAO Sihan1, ZHANG Jie1, MI Zhenguo1 and KANG Qiang2 |Show fewer author(s)
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    References(6)

    [3] [3] TILMANS H A C,COSTER J D,HELIN P,et al.MEMS packaging and reliability:An undividable couple[J].Microelectronics Reliability,2012,52(9/10):2228-2234.

    [7] [7] SUTONO A,HEO D,CHEN Y J,et al.High-Q LTCC-based passive library for wireless system-on-package(SOP) module development[J].IEEE Transactions on Microwave Theory & Techniques,2002,49(10):1715-1724.

    [8] [8] DERNOVSEK O,EBERSTEIN M,SCHILLER W A,et al. LTCC glass-ceramic composites for microwave application[J].Journal of the European Ceramic Society,2001,21(10/11):1693-1697.

    [9] [9] TOAN N,MIYASHITA H,TODA M,et al.Fabrication of an hermetically packaged silicon resonator on LTCC substrate[J].Microsystem Technologies,2013,19(8):1165-1175.

    [10] [10] HU X,BUSCHER M,MACKOWIAK P,et al.Characterization of anodic bondable LTCC for wafer-level packaging[C]//[S.l.]:Electronics Packaging Technology Conference,2017.

    [11] [11] LUCIBELLO A,MARCELLI R,PAOLA E D,et al.Fabrication and test of RF MEMS in LTCC technology[J]. Microsystem Technologies,2017(5/8):1-8.

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    JIAO Jingjing, SHI Yunbo, ZHAO Yongqi, ZHAO Sihan, ZHANG Jie, MI Zhenguo, KANG Qiang. Wireless Bonding Package Based on Low Temperature Co-fired Ceramics[J]. Piezoelectrics & Acoustooptics, 2020, 42(1): 47

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    Paper Information

    Received: Jul. 8, 2019

    Accepted: --

    Published Online: Apr. 21, 2022

    The Author Email: Jingjing JIAO (s1706152@st.nuc.edu.cn)

    DOI:10-11977/j.issn.1004-2474.2020-01-012

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