Piezoelectrics & Acoustooptics, Volume. 42, Issue 1, 47(2020)
Wireless Bonding Package Based on Low Temperature Co-fired Ceramics
[3] [3] TILMANS H A C,COSTER J D,HELIN P,et al.MEMS packaging and reliability:An undividable couple[J].Microelectronics Reliability,2012,52(9/10):2228-2234.
[7] [7] SUTONO A,HEO D,CHEN Y J,et al.High-Q LTCC-based passive library for wireless system-on-package(SOP) module development[J].IEEE Transactions on Microwave Theory & Techniques,2002,49(10):1715-1724.
[8] [8] DERNOVSEK O,EBERSTEIN M,SCHILLER W A,et al. LTCC glass-ceramic composites for microwave application[J].Journal of the European Ceramic Society,2001,21(10/11):1693-1697.
[9] [9] TOAN N,MIYASHITA H,TODA M,et al.Fabrication of an hermetically packaged silicon resonator on LTCC substrate[J].Microsystem Technologies,2013,19(8):1165-1175.
[10] [10] HU X,BUSCHER M,MACKOWIAK P,et al.Characterization of anodic bondable LTCC for wafer-level packaging[C]//[S.l.]:Electronics Packaging Technology Conference,2017.
[11] [11] LUCIBELLO A,MARCELLI R,PAOLA E D,et al.Fabrication and test of RF MEMS in LTCC technology[J]. Microsystem Technologies,2017(5/8):1-8.
Get Citation
Copy Citation Text
JIAO Jingjing, SHI Yunbo, ZHAO Yongqi, ZHAO Sihan, ZHANG Jie, MI Zhenguo, KANG Qiang. Wireless Bonding Package Based on Low Temperature Co-fired Ceramics[J]. Piezoelectrics & Acoustooptics, 2020, 42(1): 47
Received: Jul. 8, 2019
Accepted: --
Published Online: Apr. 21, 2022
The Author Email: Jingjing JIAO (s1706152@st.nuc.edu.cn)