[3] [3] TILMANS H A C,COSTER J D,HELIN P,et al.MEMS packaging and reliability:An undividable couple［J］.Microelectronics Reliability,2012,52(9/10):2228-2234.

[7] [7] SUTONO A,HEO D,CHEN Y J,et al.High-Q LTCC-based passive library for wireless system-on-package(SOP) module development［J］.IEEE Transactions on Microwave Theory & Techniques,2002,49(10):1715-1724.

[8] [8] DERNOVSEK O,EBERSTEIN M,SCHILLER W A,et al. LTCC glass-ceramic composites for microwave application［J］.Journal of the European Ceramic Society,2001,21(10/11):1693-1697.

[9] [9] TOAN N,MIYASHITA H,TODA M,et al.Fabrication of an hermetically packaged silicon resonator on LTCC substrate［J］.Microsystem Technologies,2013,19(8):1165-1175.

[10] [10] HU X,BUSCHER M,MACKOWIAK P,et al.Characterization of anodic bondable LTCC for wafer-level packaging［C］//［S.l.］:Electronics Packaging Technology Conference,2017.

[11] [11] LUCIBELLO A,MARCELLI R,PAOLA E D,et al.Fabrication and test of RF MEMS in LTCC technology［J］. Microsystem Technologies,2017(5/8):1-8.