Piezoelectrics & Acoustooptics, Volume. 42, Issue 1, 47(2020)
Wireless Bonding Package Based on Low Temperature Co-fired Ceramics
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JIAO Jingjing, SHI Yunbo, ZHAO Yongqi, ZHAO Sihan, ZHANG Jie, MI Zhenguo, KANG Qiang. Wireless Bonding Package Based on Low Temperature Co-fired Ceramics[J]. Piezoelectrics & Acoustooptics, 2020, 42(1): 47
Received: Jul. 8, 2019
Accepted: --
Published Online: Apr. 21, 2022
The Author Email: Jingjing JIAO (s1706152@st.nuc.edu.cn)