Piezoelectrics & Acoustooptics, Volume. 42, Issue 1, 47(2020)

Wireless Bonding Package Based on Low Temperature Co-fired Ceramics

JIAO Jingjing1,*... SHI Yunbo1, ZHAO Yongqi1, ZHAO Sihan1, ZHANG Jie1, MI Zhenguo1 and KANG Qiang2 |Show fewer author(s)
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    JIAO Jingjing, SHI Yunbo, ZHAO Yongqi, ZHAO Sihan, ZHANG Jie, MI Zhenguo, KANG Qiang. Wireless Bonding Package Based on Low Temperature Co-fired Ceramics[J]. Piezoelectrics & Acoustooptics, 2020, 42(1): 47

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    Paper Information

    Received: Jul. 8, 2019

    Accepted: --

    Published Online: Apr. 21, 2022

    The Author Email: Jingjing JIAO (s1706152@st.nuc.edu.cn)

    DOI:10-11977/j.issn.1004-2474.2020-01-012

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