To improve the reliability of MEMS accelerometers, reduce sensor failures caused by wire bonding breakage, a wireless bonding package based on low temperature co-fired ceramics (LTCC) is designed in this paper. The package uses an anodic bonding technique to connect the LTCC substrate to the chip,and simultaneously integrates the circuit transfer board synchronously.This package structure can reduce the package size of the sensor and effectively improve the reliability of the MEMS accelerometers.