Optics and Precision Engineering, Volume. 16, Issue 8, 1440(2008)

Phase transformations of grinding monocrystalline silicon wafer surfaces

ZHANG Yin-xia1,*... GAO Wei1, KANG Ren-ke2 and GUO Dong-ming2 |Show fewer author(s)
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  • 1[in Chinese]
  • 2[in Chinese]
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    References(8)

    [4] [4] GOGOTSI Y,ZHOU G,KU S S,et al..Raman microspectroscopy analysis of pressure-induced metallization in scratching of silicon[J].Semiconductor Science Technology,2001,16:345-352

    [5] [5] ZARUDI I,ZHANG L C.Structure changes in monocrystalline silicon subjected to indentation-experimental findings[J].Tribology International,1999,32:701-712

    [6] [6] ROBERTS S G.Fracture and Brittle-ductile Transition in Si,Properties of Crystalline Silicon[M].London:INSPEC,the Institution of Electrical Engineers,1999

    [7] [7] GOGOTSI Y,BAED C.Raman microspectroscopy study of processing-induced phase transformations and residual stress in silicon[J].Semiconductor Science Technology,1999,14:936-944

    [8] [8] KAILER A,GOGOTSI Y,NICKEL K G.Phase transformations of silicon caused by contact loading[J].J.Appl.Phys.,1997,81:3057-3063

    [9] [9] ZHANG L C,ZARUDI I.Towards a deeper understanding of plastic deformation in monocrystalline silicon[J].International J.Mechanical Sciences,2001,43:1985-1996

    [10] [10] CRAIN J,ACKLAND G J,MACLEAN J R,et al..Reversible pressure-induced transitions between metastable phases of silicon[J].Physical Review B,1994,50(17):13043-13046

    [11] [11] PIZANI P S,JASINEVICIUS R.Ductile and brittle modes in single-point-diamond-turning of silicon probed by Raman scattering[J].J.Materials Science Lett.,1999,18:1185-1187

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    [1] WANG Zi-guang, GAO Shang, ZHU Xiang-long, DONG Zhi-gang, KANG Ren-ke. Grinding wheel for low-damage grinding of silicon wafers and its grinding performance[J]. Optics and Precision Engineering, 2017, 25(10): 2689

    [2] QIU Zhong-jun, ZHOU Li-bo, FANG Feng-zhou, SHINA Tsuyoshi, EDA Hiroshi. Chemical mechanical grinding for quartz glass[J]. Optics and Precision Engineering, 2010, 18(7): 1544

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    ZHANG Yin-xia, GAO Wei, KANG Ren-ke, GUO Dong-ming. Phase transformations of grinding monocrystalline silicon wafer surfaces[J]. Optics and Precision Engineering, 2008, 16(8): 1440

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    Paper Information

    Category:

    Received: Jan. 7, 2008

    Accepted: --

    Published Online: Feb. 28, 2010

    The Author Email: Yin-xia ZHANG (zhangyinxia@zzu.edu.cn)

    DOI:

    CSTR:32186.14.

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