Optics and Precision Engineering, Volume. 32, Issue 15, 2418(2024)
Vertical clamping deformation analysis and validation of 300 mm wafer warpage detection
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Yibo ZHANG, Xinxin KONG, Sizepeng ZHAO, Jingang JIA, Dehuai JIANG, Jiahui SONG, Zhou WU. Vertical clamping deformation analysis and validation of 300 mm wafer warpage detection[J]. Optics and Precision Engineering, 2024, 32(15): 2418
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Received: Dec. 7, 2023
Accepted: --
Published Online: Sep. 27, 2024
The Author Email: KONG Xinxin (kongxx@aircas.ac.cn)