Optics and Precision Engineering, Volume. 32, Issue 15, 2418(2024)
Vertical clamping deformation analysis and validation of 300 mm wafer warpage detection
Figures & Tables(13)
Fig. 4. Sensitivity analysis of thickness direction deviation in three-point and four-point clampings
Fig. 6. Illustration of vertical wafer clamping structure and interconnection
Fig. 8. Correlation between fixed support location slope angle deviation and additional warpage
Fig. 10. Correlation between adjustable edge support position deviation and additional warpage
Table 1. Wafer geometry and material properties
View tableView in ArticleTable 1. Wafer geometry and material properties
Parameter Value Diameter（a/mm） 300 Thickness（t/mm） 0.775 Density（ρdensity/kg·m-3） 2 329 Young modulus （E/GPa） 162.7 Poisson's ratio （v） 0.27
Table 2. Design parameter requirements for vertical wafer clamping
View tableView in ArticleTable 2. Design parameter requirements for vertical wafer clamping
Design parameters Requirement Vertical tilt angle ≤0.02° Fixed edge support slope angle 35°±1° Adjustable edge support clamping force magnitude ≤2 N Adjustable edge support position 0°±2°
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Yibo ZHANG, Xinxin KONG, Sizepeng ZHAO, Jingang JIA, Dehuai JIANG, Jiahui SONG, Zhou WU. Vertical clamping deformation analysis and validation of 300 mm wafer warpage detection[J]. Optics and Precision Engineering, 2024, 32(15): 2418
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Received: Dec. 7, 2023
Accepted: --
Published Online: Sep. 27, 2024
The Author Email: KONG Xinxin (kongxx@aircas.ac.cn)
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