Fig. 1. Image and intensity distribution of femtosecond laser-induced plasma filament ^［16］

Fig. 2. Schematic diagram of femtosecond laser filament processing for high aspect ratio groove cutting ^［19］

Fig. 3. Processing procedures for fused silicon wafer^［20］

Fig. 4. V-shaped groove morphology of laser filament processing ^［24］

Fig. 5. Processing high aspect ratio holes in fused silica using femtosecond laser filament ^［25］

Fig. 6. Femtosecond laser filament for processing Bragg gratings on single-mode fibers^［28］

Fig. 7. Application of femtosecond laser filament in the processing of large amplitude terahertz communication devices ^［36］

Fig. 8. Femtosecond laser filament welding device and experimental results ^［39］

Fig. 9. Laser filament separates SiC wafer elements with a thickness of 0.5 mm into two pieces with a thickness of 0.25 mm^［45］

Fig. 10. Femtosecond laser filament cutting of bone and meat ^［37］

Fig. 11. The femtosecond laser with a central wavelength of 800 nm was used to treat the breast cancer tumor in the left leg of mice for 23 days and compared with the control group in the right leg^［47］