Journal of Inorganic Materials, Volume. 38, Issue 11, 1371(2023)

Fabrication of 8-inch N-type 4H-SiC Single Crystal Substrate with Low Dislocation Density

Xixi XIONG1... Xianglong YANG1,*, Xiufang CHEN1,*, Xiaomeng LI1, Xuejian XIE1, Guojie HU1, Yan PENG1, Guojian YU2, Xiaobo HU1, Yaohao WANG2 and Xiangang XU1 |Show fewer author(s)
Author Affiliations
  • 11. Institute of Novel Semiconductors, State Key Laboratory of Crystal Materials, Shandong University, Jinan 250100, China
  • 22. Guangzhou Summit Crystal Semiconductor Co., Ltd., Guangzhou 511458, China
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    References(10)

    [1] R R SIERGIEJ, R C CLARKE, S SRIRAM et al. Advances in SiC materials and devices: an industrial point of view. Materials Science and Engineering: B, 9(1999).

    [3] L CHENG, J W PALMOUR, A K AGARWAL et al. Strategic overview of high-voltage SiC power device development aiming at global energy savings. Materials Science Forum, 1089(2014).

    [4] E MORVAN, A KERLAIN, C DUA et al. Influence of material properties on wide-bandgap microwave power device characteristics. Materials Science Forum, 731(2003).

    [7] Y PENG, X F CHEN, J PENG et al. Study on the growth of high quality semi-insulating ϕ150 mm 4H-SiC single crystal. Journal of Synthetic Crystals, 1145(2016).

    [8] X L YANG, X F CHEN, X J XIE et al. Growth of 8 inch conductivity type 4H-SiC single crystals. Journal of Synthetic Crystals, 1745(2022).

    [9] Y F LOU, T C GONG, W ZHANG et al. Fabrication and characterizations of 8-inch n type 4H-SiC single crystal substrate. Journal of Synthetic Crystals, 2131(2022).

    [10] G YANG, X S LIU, J J LI et al. Dislocations in 4H silicon carbide single crystals. Journal of Synthetic Crystals, 1673(2022).

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    Xixi XIONG, Xianglong YANG, Xiufang CHEN, Xiaomeng LI, Xuejian XIE, Guojie HU, Yan PENG, Guojian YU, Xiaobo HU, Yaohao WANG, Xiangang XU. Fabrication of 8-inch N-type 4H-SiC Single Crystal Substrate with Low Dislocation Density[J]. Journal of Inorganic Materials, 2023, 38(11): 1371

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    Paper Information

    Category:

    Received: Jul. 18, 2023

    Accepted: --

    Published Online: Mar. 6, 2024

    The Author Email: Xianglong YANG (yangxl2016@sdu.edu.cn), Xiufang CHEN (cxf@sdu.edu.cn)

    DOI:10.15541/jim20230325

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