[1] [1] Jiang Bin, Song Guohua, Miao Jianwen, et al.. Thermal analysis of high-power LED based on COB packaging technology [J]. Electronic Components and Materials, 2011, 30(6): 48-52.

[2] [2] Lan Hai, Deng Zhonghua, Liu Zhuguang, et al.. Thermal simulation for design of LED COB package [J]. Chin J Lumin, 2012, 33(5): 535-539.

[3] [3] Jin Rongfu, Cai Qiongying, Xia Yujie. Thermally conductive plastics used in LED [J]. Engineering Plastics Application, 2011, 39(10): 100-102.

[4] [4] Tian Dalei, Guan Rongfeng, Wang Xing. Thermal analysis of finite element for high-power LED packaging [J]. Semiconductor Technology, 2008, 33(3): 248-251.

[5] [5] Wang Jing, Wu Fugen. Key issues of improving cooling of high-bightness LED [J]. Electronic Design Engineering, 2009, 17(4): 123-125.

[6] [6] Mao Yuhai. LED ceiling-mounted light and power supply [J]. China Illumination, 2012, (1): 86-98.

[7] [7] Dai Weifeng, Wang Jun, Li Yuesheng. Transient thermal analysis of high-power LED package [J]. Semiconductor Optoelectronics, 2008, 29(3): 324-328.

[8] [8] Chen Jianlong, Wen Shangsheng, Yao Rihui, et al.. Thermal analysis of high-power LED without aluminum substrate [J]. Chin J Lumin, 2012, 33(12): 1362-1367.