Acta Optica Sinica, Volume. 33, Issue 8, 823005(2013)
Thermal Analysis for LED Chip on Board Package Based on Plastic Radiator without Substrate
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Chen Yingcong, Wen Shangsheng, Wu Yuxiang. Thermal Analysis for LED Chip on Board Package Based on Plastic Radiator without Substrate[J]. Acta Optica Sinica, 2013, 33(8): 823005
Category: Optical Devices
Received: Mar. 25, 2013
Accepted: --
Published Online: Jul. 9, 2013
The Author Email: Yingcong Chen (cyc_scut@163.com)