Optics and Precision Engineering, Volume. 18, Issue 5, 1189(2010)

Ultrasonic precise bonding for polymer micro device based on adaptive pressure control

SUN Yi-bo1、*, LUO Yi1,2, and WANG Xiao-dong1,2
Author Affiliations
  • 1[in Chinese]
  • 2[in Chinese]
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    References(14)

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    [5] [5] ANDRIJASEVIC D, GIOUROUDI L, SMETANA W, et al..New approach to micro-joining by hot gas stream[J].Microelectronic Engineering, 2006,83(4-9):1445-1448.

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    [8] [8] SARI F, HOFFMANN W M, HABERSTROH E, et al..Applications of laser transmission processes for the joining of plastics, silicon and glass micro parts[J].Microsystem Technologies, 2008,14(12):1879-1886.

    [9] [9] TRUCKENMLLER R, HENZI P, HERRMANN D, et al.Bonding of polymer microstructures by UV irradiation and subsequent welding at low temperatures[J].Microsystem Technologies, 2004,10(5):372-374.

    [10] [10] TRUCKENMUELLER R, CHEN Y, AHRENS R, et al..Micro ultrasonic welding: Joining of chemically inert polymer microparts for single material fluidic components and systems[J].Microsystem Technologies, 2006,12(10-11):1027-1029.

    [11] [11] KHMELEV V N, SIVIN A N, ABRAMOV A D.Model of process and calculation of energy for a heat generation of a welded joint at ultrasonic welding polymeric thermoplastic materials[C].8th Annual International Workshop and Tutorials on Electron Devices and Materials, EDM'07 – Proceedings, 2007:316-322.

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    CLP Journals

    [1] LUO Yi, ZHANG Miao-miao, SUN Yi-bo, WANG Xiao-dong. Micro energy director array for ultrasonic precise sealing of polymer MEMS device[J]. Optics and Precision Engineering, 2011, 19(4): 754

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    SUN Yi-bo, LUO Yi, WANG Xiao-dong. Ultrasonic precise bonding for polymer micro device based on adaptive pressure control[J]. Optics and Precision Engineering, 2010, 18(5): 1189

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    Paper Information

    Category:

    Received: Jul. 27, 2009

    Accepted: --

    Published Online: Aug. 31, 2010

    The Author Email: Yi-bo SUN (sun200181410@163.com)

    DOI:

    CSTR:32186.14.

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