Infrared and Laser Engineering, Volume. 52, Issue 5, 20220705(2023)

Design of thermal control system for high-speed communication optical module

Boren Guan1, Mingyu Li1, Renhui Deng2, Haiyang Hu2, and Zhe Lian2
Author Affiliations
  • 1School of Optoelectronic Engineering, Changchun University of Science and Technology, Changchun 130022, China
  • 2The Equipment Department of Semight Instrument Co., Ltd., Suzhou 215000, China
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    References(16)

    [1] [1] Zhang Taolue, Li Qibo, Shankaran G, et al. Fan cooling investigation f highspeed electronic interconnect [EBOL]. (20220707) [20220902]. https:doi.g10.108001457632.2022.2093530.

    [3] [3] Golds H J. Electronic Refrigeration[M]. Berlin: Springer, 1986.

    [4] [4] Rowe D M, Pollock D D, Stockholm J G, et al. CRC Hbook of Thermoelectrics[M]. Boca Raton: CRC Press, 2018.

    [6] Y F Pang. The theoretical analysis and experimental research on the optimal condition of semiconductor refrigeration. IOP Conference Series: Earth and Environmental Science, 40, 340-348(2016).

    [13] [13] Liu Ning. Research on fluid flow heat transfer acteristics of liquidcooling system[D]. Nanjing: Nanjing University of Science & Technonlogy, 2013. (in Chinese)

    [15] Z Luo. A simple method to estimate the physical characteristics of a thermoelectric cooler from vendor datasheets. Electronics Cooling, 14, 22-27(2008).

    [16] Wengang Yang, Xuewu Fan, Chenjie Wang, . Design and test of thermo electric cooling system for space based telescope detector assembly. Acta Photonica Sinica, 49, 0822001(2020).

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    Boren Guan, Mingyu Li, Renhui Deng, Haiyang Hu, Zhe Lian. Design of thermal control system for high-speed communication optical module[J]. Infrared and Laser Engineering, 2023, 52(5): 20220705

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    Paper Information

    Category: Optical communication and sensing

    Received: Sep. 30, 2022

    Accepted: --

    Published Online: Jul. 4, 2023

    The Author Email:

    DOI:10.3788/IRLA20220705

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