[1] Gao H, Zhao S Q. Exploration of applications of IR image simulator[J]. Infrared Technology, 36, 409-414(2014).

[2] Zhao S Q, Wu G S, Liu X N et al. 256 × 256 unit element MOS minute resistance array dynamic scene producing device[J]. Aero Weaponry, 40-45(2015).

[3] Zhao S Q, Wu Y G. Some problems in optical projection system design of infrared imaging target simulator[C], 470-475(2001).

[4] Zhao S Q, Wu Y G, Liu X N et al. Test method for radiation characteristics of MOS resistor array infrared dynamic scene simulator[C], 37-41(2011).

[5] Zheng Z, Zou Y G, Shi L L et al. High-contrast grating structure design for liquid crystal tunable vertical-cavity surface-emitting lasers[J]. Laser & Optoelectronics Progress, 57, 011402(2020).

[6] Liu F H, Gong X, Zhang Y N et al. Research progress on 808 nm VCSEL-array-pumped solid-state lasers[J]. Laser & Optoelectronics Progress, 56, 120001(2019).

[7] Yan Y Y, Chen Z W, Qiu J et al. Effect of package on luminescence characteristics of high-power VCSEL with narrow pulse[J]. Acta Optica Sinica, 40, 0814001(2020).

[8] Lim Y L, Nikolic M, Bertling K et al. Self-mixing imaging sensor using a monolithic VCSEL array with parallel readout[J]. Optics Express, 17, 5517-5525(2009).

[9] Safaisini R, Joseph J R, Dang G T et al. Scalable high-power, high-speed CW VCSEL arrays[J]. Electronics Letters, 45, 414-415(2009).

[10] Nakwaski W, Osiński M. Thermal analysis of etched-well surface-emitting diode lasers[J]. Microwave and Optical Technology Letters, 4, 541-543(1991).

[11] Nakwaski W. Dynamical thermal properties of stripe-geometry laser diodes[J]. IEE Proceedings I Solid State and Electron Devices, 131, 94-102(1984).

[12] Hasnain G, Tai K, Yang L et al. Performance of gain-guided surface emitting lasers with semiconductor distributed Bragg reflectors[J]. IEEE Journal of Quantum Electronics, 27, 1377-1385(1991).

[13] Tell B, Brown-Goebeler K F, Leibenguth R E. Thermal characteristics of deep red (0.77 μm) vertical-cavity surface-emitting lasers[J]. IEEE Photonics Technology Letters, 4, 521-523(1992).

[14] Eitel S, Hunziker S G, Vez D et al. Multimode VCSELs for high bit-rate and transparent low-cost fiber-optic links[J]. Proceedings of SPIE, 4649, 183-190(2002).

[15] Kageyama N, Torii K, Morita T et al. Efficient and reliable high-power laser diode bars with low-smile implementation[J]. IEEE Journal of Quantum Electronics, 48, 991-994(2012).

[16] Petzold M, Altmann F, Krause M et al. Micro structure analysis for system in package components: novel tools for fault isolation, target preparation, and high-resolution material diagnostics[C], 1296-1302(2010).

[17] Tekin T. Review of packaging of optoelectronic, photonic, and MEMS components[J]. IEEE Journal of Selected Topics in Quantum Electronics, 17, 704-719(2011).

[18] Tummala R. Fundamentals of microsystems packaging[J]. Microelectronics International, 20, 60(2003).