VCSEL Array Microsystem Packaging Based on SiP Technology

Lihao Wang; Dengyuan Fu; Junyuan Zhao; Songqing Zhao; Genshui Wu; Haiyan Chen; Yinfang Zhu; Jinling Yang

doi:10.3788/LOP202158.2114011

Laser & Optoelectronics Progress, Volume. 58, Issue 21, 2114011(2021)

VCSEL Array Microsystem Packaging Based on SiP Technology

Lihao Wang^1,2,3, Dengyuan Fu^1,2,3, Junyuan Zhao^1,2,3, Songqing Zhao^4,5, Genshui Wu^4,5, Haiyan Chen^4,5, Yinfang Zhu^1,2,3、*, and Jinling Yang^1,2,3、**

Author Affiliations

¹Engineering Research Center for Semiconductor Integrated Technology, Institute of Semiconductors, Chinese Academy of Sciences, Beijing 100083, China

²Center of Materials Science and Optoelectronics Engineering, University of Chinese Academy of Sciences, Beijing 100049, China

³State Key Laboratory of Transducer Technology, Shanghai 200050, China

⁴China Airbome Missile Academy, Luoyang , Henan 471009, China

⁵Aviation Key Laboratory of Science and Technology on Airbome Guided Weapons, Luoyang , Henan 471009, China

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Figures & Tables(5)

Fig. 1. Structure diagram of system package

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Fig. 2. Operating temperature characteristics of single device. (a) Temperature distribution diagram; (b) radial temperature curve

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Fig. 3. Operating temperature characteristics of the device array. (a) Temperature distribution diagram; (b) radial temperature curve

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Fig. 4. Schematic diagram of laser array drive module

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Fig. 5. Cross-sectional view of manufacturing process

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Lihao Wang, Dengyuan Fu, Junyuan Zhao, Songqing Zhao, Genshui Wu, Haiyan Chen, Yinfang Zhu, Jinling Yang. VCSEL Array Microsystem Packaging Based on SiP Technology[J]. Laser & Optoelectronics Progress, 2021, 58(21): 2114011

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Paper Information

Category: Lasers and Laser Optics

Received: Oct. 16, 2020

Accepted: Dec. 27, 2020

Published Online: Nov. 1, 2021

The Author Email: Zhu Yinfang (yfzhu@semi.ac.cn), Yang Jinling (jlyang@semi.ac.cn)

DOI:10.3788/LOP202158.2114011

Topics

laser devices and laser physics

Lasers and Laser Optics

Laser physics

laser manufacturing

Instrumentation, Measurement and Metrology