Laser & Optoelectronics Progress, Volume. 58, Issue 21, 2114011(2021)
VCSEL Array Microsystem Packaging Based on SiP Technology
This paper proposes a microsystem composed of vertical cavity surface-emitting laser arrays, laser driver chips, and power chips based on system in package technology to meet the needs of the hardware-in-the-loop simulation system. In addition, a manufacturing process flow based on microelectromechanical systems technology was developed. The packaging method has a high level of integration and high reliability. Driving efficiency and space utilization are significantly improved compared with other driving and packaging methods. Consequently, it has broad application prospects in optical imaging, communication, and interconnection, laying the groundwork for realizing the laser-imaging generator in semi-physical simulation systems.
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Lihao Wang, Dengyuan Fu, Junyuan Zhao, Songqing Zhao, Genshui Wu, Haiyan Chen, Yinfang Zhu, Jinling Yang. VCSEL Array Microsystem Packaging Based on SiP Technology[J]. Laser & Optoelectronics Progress, 2021, 58(21): 2114011
Category: Lasers and Laser Optics
Received: Oct. 16, 2020
Accepted: Dec. 27, 2020
Published Online: Nov. 1, 2021
The Author Email: Zhu Yinfang (yfzhu@semi.ac.cn), Yang Jinling (jlyang@semi.ac.cn)