Microelectronics, Volume. 53, Issue 3, 465(2023)
Research Progress of High Density Interconnection Technology for SiC Power Devices
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WANG Zhikuan, FENG Zhihua, CHEN Rong, YAN Zipeng, CUI Wei, LU Ke, LIAO Xiyi. Research Progress of High Density Interconnection Technology for SiC Power Devices[J]. Microelectronics, 2023, 53(3): 465
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Received: Mar. 5, 2023
Accepted: --
Published Online: Jan. 3, 2024
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