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Microelectronics, Volume. 53, Issue 3, 465(2023)

Research Progress of High Density Interconnection Technology for SiC Power Devices

WANG Zhikuan1... FENG Zhihua2, CHEN Rong2, YAN Zipeng3, CUI Wei2, LU Ke2 and LIAO Xiyi3 |Show fewer author(s)
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    WANG Zhikuan, FENG Zhihua, CHEN Rong, YAN Zipeng, CUI Wei, LU Ke, LIAO Xiyi. Research Progress of High Density Interconnection Technology for SiC Power Devices[J]. Microelectronics, 2023, 53(3): 465

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    Received: Mar. 5, 2023

    Accepted: --

    Published Online: Jan. 3, 2024

    The Author Email:

    DOI:10.13911/j.cnki.1004-3365.230223

    Topics

    laser devices and laser physics
    Lasers and Laser Optics
    Laser physics
    laser manufacturing
    Instrumentation, Measurement and Metrology