Laser direct writing (LDW) technique has been widely used in various scientific fields because of its flexible 3D micro/nano-structure processing and manufacturing capability. Due to the diffraction limit, it is challenge to get sub 100 nm or sub 50 nm resolution and realize high throughput 3D nano-manufacturing, which is critical important for the integrated circuit industrial applications in the post-Moore law period. From the perspective of optical imaging, it is concerning with superresolution imaging with large field of view, i.e., maximum throughput spatial passband product. LDW technique focuses on writing with high throughput and high resolution. This paper will expound on the development of the LDW technique and introduce our research group's progress in the high throughput LDW technique.