Femtosecond laser shockwave peening ablation in liquids for hierarchical micro/nanostructuring of brittle silicon and its biological application

Dongshi Zhang; Liang-Chun Wu; Masashi Ueki; Yoshihiro Ito; Koji Sugioka

doi:10.1088/2631-7990/abb5f3

International Journal of Extreme Manufacturing, Volume. 2, Issue 4, 45001(2020)

Femtosecond laser shockwave peening ablation in liquids for hierarchical micro/nanostructuring of brittle silicon and its biological application

Dongshi Zhang1... Liang-Chun Wu2,3, Masashi Ueki2, Yoshihiro Ito2,4 and Koji Sugioka1,* |Show fewer author(s)

Author Affiliations

¹RIKEN Center for Advanced Photonics, Wako, Saitama 351-0198, Japan

²Nano Medical Engineering Laboratory, RIKEN Cluster for Pioneering Research, 2-1 Hirosawa, Wako,Saitama 351-0193, Japan

³Department of Chemical Science and Engineering, School of Materials and Chemical Technology,Tokyo Institute of Technology, Tokyo, Japan

⁴Emergent Bioengineering Materials Research Team, RIKEN Center for Emergent Matter Science, 2-1Hirosawa, Wako, Saitama 351-0198, Japan

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Dongshi Zhang, Liang-Chun Wu, Masashi Ueki, Yoshihiro Ito, Koji Sugioka. Femtosecond laser shockwave peening ablation in liquids for hierarchical micro/nanostructuring of brittle silicon and its biological application[J]. International Journal of Extreme Manufacturing, 2020, 2(4): 45001

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Paper Information

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Received: Apr. 14, 2020

Accepted: --

Published Online: Apr. 16, 2021

The Author Email: Sugioka Koji (ksugioka@riken.jp)

DOI:10.1088/2631-7990/abb5f3

Topics

laser devices and laser physics

Lasers and Laser Optics

Laser physics

laser manufacturing

Instrumentation, Measurement and Metrology

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