Optics and Precision Engineering, Volume. 21, Issue 4, 904(2013)
Design of optical structure for chip-on-board wafer level packaging LEDs
[1] [1] NING L, SHI Y SH, SHI Y H, et al.. Influence of package structure on LED light extraction[J]. Chinese Journal of Liquid Crystals and Displays, 2010, 25(6): 823-825. (in Chinese)
[4] [4] JIANG B, SONG G H, MIU J W, et al..Thermal analysis of high power LED based on COB packaging technology[J]. Electronic Componets and Materials, 2011, 30(6): 48-52. (in Chinese)
[5] [5] LU Y Y, LIU N T, HOU J K, et al.. Patent Analysis about COB Integrated Packaging Technology[J]. Information Research, 2012, 38(5).11-15. (in Chinese)
[8] [8] ZHANG J, FANG SH, HU ZH W, et al.. Optimized design of the primary optical system for LED packages [J]. Semiconductor optoelectronics, 2008, 29(5): 658-661. (in Chinese)
[9] [9] SHI G G. Light Emitting Diode and Solid State Lighting [M].Bei Jing: Science and Technology Press. 2007.195
[10] [10] HUANG Q L. Simulation Research and Design of LED array Based on the Uniform Illumination[D].Fu Jian: Hua Qiao University.2011. (in Chinese)
[12] [12] ZHANG G G, ZHANG CH X, et al.. Research Progress on Phosphor Excited by Near Ultraviolet for White Light-emitting Diodes[J]. Journal of Jining University, 2012, 33(6).35-38.(in Chinese)
[13] [13] LIU L, WU Q, HUANG X, et al.. Promoting of phosphor-based white-LED and optical properties[J]. Chinese Journal of Luminescence, 2007, 28(6): 890-894.(in Chinese)
Get Citation
Copy Citation Text
MA Jian-she, HE Li-yun, LIU Tong, SU Ping. Design of optical structure for chip-on-board wafer level packaging LEDs[J]. Optics and Precision Engineering, 2013, 21(4): 904
Category:
Received: Nov. 9, 2012
Accepted: --
Published Online: May. 24, 2013
The Author Email: Jian-she MA (mjs888@126.com)