Optics and Precision Engineering, Volume. 21, Issue 4, 904(2013)

Design of optical structure for chip-on-board wafer level packaging LEDs

MA Jian-she*, HE Li-yun, LIU Tong, and SU Ping
Author Affiliations
  • [in Chinese]
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    References(14)

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    CLP Journals

    [1] BAI Yi-ming, LUO Yi, HAN Yan-jun, LI Hong-tao. Calculation and optimization of light extraction efficiency for integrated LED[J]. Optics and Precision Engineering, 2014, 22(5): 1129

    [2] QIU Yan-qing, ZHANG Liu-liu, CHEN Miao-gen, WANG Cheng-qun. Photoelectric parameter measurement system for chip-on-board wafer level packaging LEDs[J]. Optics and Precision Engineering, 2016, 24(1): 39

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    MA Jian-she, HE Li-yun, LIU Tong, SU Ping. Design of optical structure for chip-on-board wafer level packaging LEDs[J]. Optics and Precision Engineering, 2013, 21(4): 904

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    Paper Information

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    Received: Nov. 9, 2012

    Accepted: --

    Published Online: May. 24, 2013

    The Author Email: Jian-she MA (mjs888@126.com)

    DOI:10.3788/ope.20132104.0904

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