Optics and Precision Engineering, Volume. 21, Issue 4, 904(2013)
Design of optical structure for chip-on-board wafer level packaging LEDs
Figures & Tables(0)
Tools
Get Citation
Copy Citation Text
MA Jian-she, HE Li-yun, LIU Tong, SU Ping. Design of optical structure for chip-on-board wafer level packaging LEDs[J]. Optics and Precision Engineering, 2013, 21(4): 904
Paper Information
Category:
Received: Nov. 9, 2012
Accepted: --
Published Online: May. 24, 2013
The Author Email: Jian-she MA (mjs888@126.com)
© Copyright 2018-2021 | Chinese Laser Press.
All Rights Reserved 沪ICP备15018463号-20