Acta Optica Sinica (Online), Volume. 1, Issue 1, 0104001(2024)

Hybrid Integration of Single-Photon Avalanche Diode Array and Silicon Photonic Chip (Invited)

Xiaosong Ren1, Yuanbin Fan2, Yanli Shi3, Zhiliang Yuan2, Yidong Huang1,2、*, and Wei Zhang1,2
Author Affiliations
  • 1Department of Electronic Engineering, Beijing National Research Center for Information Science and Technology, Frontier Science Center for Quantum Information, Tsinghua University, Beijing 100084, China
  • 2Beijing Academy of Quantum Information Sciences, Beijing 100193, China
  • 3School of Physics and Astronomy, Yunnan University, Kunming 650091, Yunnan , China
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    References(37)

    [27] Elenius P, Levine L. Comparing flip-chip and wire-bond interconnection technologies[J]. Chip Scale Review, 4, 81-87(2000).

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    Xiaosong Ren, Yuanbin Fan, Yanli Shi, Zhiliang Yuan, Yidong Huang, Wei Zhang. Hybrid Integration of Single-Photon Avalanche Diode Array and Silicon Photonic Chip (Invited)[J]. Acta Optica Sinica (Online), 2024, 1(1): 0104001

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    Paper Information

    Category: Research Articles

    Received: Jul. 1, 2024

    Accepted: Jul. 23, 2024

    Published Online: Sep. 18, 2024

    The Author Email: Huang Yidong (yidonghuang@tsinghua.edu.cn)

    DOI:10.3788/AOSOL240436

    CSTR:32394.14.AOSOL240436

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