Optics and Precision Engineering, Volume. 18, Issue 10, 2178(2010)

Dynamic testing of MEMS micro-structure and its measurement system at low temperatures

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    References(13)

    [1] [1] ZHOU Z Y,YE X Y,CUI T H,et al.. Microtechnology/Nanotechnology and MEMS [J]. Opt. Precision Eng.,1998,6(2):1-7. (in Chinese)

    [2] [2] WEN H K. Trends and frontiers of MEMS [J]. Sensors and Actuators A,2007,136:62-67.

    [3] [3] TANAKA M. An industrial and applied review of new MEMS device features [J]. Microelectronic Engineering,2007,84:1341-1344.

    [4] [4] CHOA S H. Reliability of vacuum packaged MEMS gyroscopes [J]. Microelectronics Reliability,2005,45:361-369.

    [5] [5] TANNER D M. MEMS reliability: where are we now [J]. Microelectronics Reliability,2009,49:937-940.

    [6] [6] RAITERI R,GRATTAROLA M,BUTT H J,et al.. Micromechanical cantilever-based biosensors [J]. Sensors and Actuators B,2001,79:115-126.

    [7] [7] MERTEN J,FIONOT E,THUNDAT,et al.. Effects of temperature and pressure on microcantilever resonance response [J]. Ultramicroscopy.2003,97(1-4):119-126.

    [8] [8] WANG T. Study on Dynamic Charaeteristics and Testing Technology of Microstrueture under High g-Force [D]. Dalian: Dalian University of Technology,2008:56-57. (in Chinese)

    [9] [9] LIN R M,WANG W J. Structural dynamics of Microsystems-current state of research and future directions [J]. Mechanical Systems and Signal Processing,2006,1015-1043.

    [10] [10] LI Z,WANG X J. MEMS measurement technologies and methods[J]. Opt. Precision Eng.,2003,11 (1):37-44. (in Chinese)

    [11] [11] WANG W L,ZHANG W,LUO W D, et al.. Dynamics of Structures [M].Shanghai: Fudan University Press. 1993. 245-251.(in Chinese)

    [12] [12] PETERSEN K. Silicon as a mechanical materials [J]. Proceedings of IEEE on Electron Devices. 1982,70(5):420-457.

    [13] [13] MCSKIMIN H J. Measurement of elastic constants at low temperature by means of ultrasonic waves data for silicon and germanium single crystals and for fused silica [J]. J.Appl.Phy. 1953,(24):988-997.

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    [in Chinese], [in Chinese], [in Chinese], [in Chinese], [in Chinese]. Dynamic testing of MEMS micro-structure and its measurement system at low temperatures[J]. Optics and Precision Engineering, 2010, 18(10): 2178

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    Paper Information

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    Received: Dec. 8, 2009

    Accepted: --

    Published Online: Feb. 15, 2011

    The Author Email: (dutsds@gmail.com)

    DOI:

    CSTR:32186.14.

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