Chinese Optics Letters, Volume. 13, Issue 8, 082201(2015)

Three-step lithography to the fabrication of vertically coupled micro-ring resonators in amorphous silicon-on-insulator

Jun Cheng* and Nan Yan
Author Affiliations
  • School of Electromechanical Engineering, Beijing Institute of Technology, Beijing 100081, China
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    Figures & Tables(10)
    Vertically coupled micro-ring resonators. (a) Four-port and (b) two-port configurations.
    Characterization of the material properties. (a) The FTIR spectrum. (b) The IR camera image of loss streak from a 200 nm a-Si:H wafer. (c) The data extracted from this image fitted with a linear decay.
    Whole lithography processes.
    Ma-N 2405 dose testing result.
    Optical microscopy picture of the first layer of a two-port ring resonator.
    Scanning electron microscope pictures of straight waveguide, mark, and first layer of four-port racetrack resonator after etching.
    Optical microscopy photograph of windows pattern on bottom marks after development.
    Micro-ring resonator testing result.
    • Table 1. Hydrogenated Amorphous Silicon Deposition Conditions

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      Table 1. Hydrogenated Amorphous Silicon Deposition Conditions

      T (°C)P (mTorr)SiH4(sccm)He (sccm)RF power (W)Deposition rate (nm/min)Refractive index n
      25015002547510203.6
    • Table 2. Su-8 Coating and Etching Conditions

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      Table 2. Su-8 Coating and Etching Conditions

      Su-8 CoatingSpinning rate(r/min)Spinning t(min)Bake T(°C)Bake t(min)UV light t(min)Bake T(°C)Bake t(min)Thick (nm)
      20000.59010.19014600
      Su-8 EtchingPressure (mTorr)O2 (sccm)Ar (sccm)CHF3 (sccm)RF power (W)T(°C)Deposited rate(nm/min)
      1530231010336
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    Jun Cheng, Nan Yan. Three-step lithography to the fabrication of vertically coupled micro-ring resonators in amorphous silicon-on-insulator[J]. Chinese Optics Letters, 2015, 13(8): 082201

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    Paper Information

    Category: Optical Design and Fabrication

    Received: Mar. 21, 2015

    Accepted: Jun. 8, 2015

    Published Online: Sep. 14, 2018

    The Author Email: Jun Cheng (2120100260@bit.edu.cn)

    DOI:10.3788/COL201513.082201

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