Chinese Physics B, Volume. 29, Issue 10, (2020)

Simulation study of device physics and design of GeOI TFET with PNN structure and buried layer for high performance

Bin Wang1,†... Sheng Hu1, Yue Feng1, Peng Li2, Hui-Yong Hu1 and Bin Shu1 |Show fewer author(s)
Author Affiliations
  • 1State Key Discipline Laboratory of Wide Bandgap Semiconductor Technology, School of Microelectronics, Xidian University, Xi’an 7007, China
  • 2Xi’an Microelectronic Technology Institute, Xi’an 710054, China
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    Figures & Tables(13)
    Cross section of device structure of normal PNN TFET based on FD-GeOI.
    Cross-section of two tunneling paths (TTP) TFET based on PD-GeOI substrate.
    Computed energy-band diagrams of TTP TFET for both off-state (solid line, |VDS| = 1 V, VGS = 0 V) and on-state (dashed line, |VDS| = 1 V, VGS = 1 V) along (a) line tunneling path 1 and (b) line tunneling path 2.
    Transfer characteristics of FD-GOI TFET and proposed TTP TFET.
    Composition of current of the proposed TTP TFET.
    Transfer characteristics of TTP TFET for different lengths of buried layer LBP.
    Distributions of surface electron density along x axis of TTP TFET for different values of LBP at VGS = 1 V and VDS = 1 V.
    Point tunneling width when LBP = 50 nm and 100 nm at VGS = 0 V and VDS = 1 V.
    Band bending from channel to LDR along x axis at the upper right-hand corner of the buried layer for (a) off-state at VDS = 1 V, VGS = 0 V and (b) on-state at VDS = 1 V, VGS = 1 V.
    Transfer characteristics of TTP TFET for different doping concentrations of slightly doped region (NLDR).
    Plots of optimized performance of TTP TFET for LBP = 50 nm, 250 nm, 450 nm, and 650 nm at Lgap = 50 nm.
    Output characteristics of TTP TFET.
    • Table 1. Simulated device parameters used in this study.

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      Table 1. Simulated device parameters used in this study.

      ParameterTTP TFETPNN TFET
      Gate length Lch/nm100100
      Channel doping/cm−31 × 10191 × 1019
      HfO2 thickness Tox/nm33
      Buried layer length LBP/nm50
      Epitaxial layer doping Nepicm−31 × 1017
      Buried doing NBP/cm−31 × 1020
      Lightly doped region NLD/cm−35 × 1018
      Gate metalaluminumgold
      Source/drain-metalaluminumaluminum
      Source/drain-doping/cm−31 × 10201 × 1020
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    Bin Wang, Sheng Hu, Yue Feng, Peng Li, Hui-Yong Hu, Bin Shu. Simulation study of device physics and design of GeOI TFET with PNN structure and buried layer for high performance[J]. Chinese Physics B, 2020, 29(10):

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    Paper Information

    Received: Apr. 23, 2020

    Accepted: --

    Published Online: Apr. 21, 2021

    The Author Email: Wang Bin (wbin@xidian.edu.cn)

    DOI:10.1088/1674-1056/ab99b5

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