[1] [1] Chaloun T, Brandl S, Ambrosius N, et al. RF glass technology is going mainstream: Review and future applications [J]. IEEE Journal of Microwaves, 2023, 3(2): 783-799.

[2] [2] Mller J, Kaltwasser M, Bartsch H, et al. Glass and Glass/LTCC interposers as heterogenous integration platform [C]// 2024 Pan Pacific Strategic Electronics Symposium (Pan Pacific), 2024: 1-7.

[4] [4] Low K K W, Kanar T, Zihir S, et al. A 17.7-20.2-GHz 1 024- element K-band SATCOM phased-array receiver with 8.1-dB/KG/T, ±70° beam scanning, and high transmit isolation [J]. IEEE Transactions on Microwave Theory and Techniques, 2022, 70(3): 1769-1778.

[5] [5] Kam D G, Liu D, Natarajan A, et al. LTCC packages with embedded phased-array antennas for 60 GHz communications [J]. IEEE Microwave and Wireless Components Letters, 2011, 21(3): 142-144.

[6] [6] Watanabe A O, Ali M, Sayeed S Y B, et al. A review of 5G front-end systems package integration [J]. IEEE Transactions on Components, Packaging and Manufacturing Technology, 2020, 11(1): 118-133.

[8] [8] Zhao J, Chen Z, Qin F, et al. Development of high performance 2.5 D packaging using glass interposer with Through Glass Vias [J]. Journal of Materials Science: Materials in Electronics, 2023, 34(25): 1790.

[9] [9] Cai L, Wu J, Lamberson L, et al. Glass for 5G applications [J]. Applied Physics Letters, 2021, 119(8): 082901.

[10] [10] Tummala R, Deprospo B, Dwarakanath S, et al. Glass panel packaging, as the most leading-edge packaging: Technologies and applications [C]// 2020 Pan Pacific Microelectronics Symposium (Pan Pacific), 2020: 1-5.

[12] [12] Watanabe A O, Lin T H, Ali M, et al. Ultrathin antenna-integrated glass-based millimeter-wave package with Through-Glass Vias [J]. IEEE Transactions on Microwave Theory and Techniques, 2020, 68(12): 5082-5092.

[13] [13] Zhong Y, Bao S, He Y, et al. Heterogeneous integration of diamond-on-chip-on-glass interposer for efficient thermal management [J]. IEEE Electron Device Letters, 2024, 45(3): 448-451.

[14] [14] Watanabe A O, Ali M, Zhang R, et al. Glass-based IC-embedded antenna-integrated packages for 28-GHz high-speed data communications [C]// 2020 IEEE 70th Electronic Components and Technology Conference (ECTC), 2020: 89-94.

[16] [16] Jia X, Li X, Moon K, et al. Antenna-integrated, die-embedded glass package for 6G wireless applications [C]// 2022 IEEE 72nd Electronic Components and Technology Conference (ECTC), 2022: 377-383.

[17] [17] Yu T, Zhang X, Chen L, et al. Development of embedded glass wafer fan-out package with 2D antenna arrays for 77 GHz millimeter-wave chip [C]// 2020 IEEE 70th Electronic Components and Technology Conference (ECTC), 2020: 31-36.

[18] [18] Galler T, Chaloun T, Mayer W, et al. Glass package for radar MMICs above 150 GHz [J]. IEEE Journal of Microwaves, 2021, 2(1): 97-107.

[19] [19] Li X, Jia X, Kim J W, et al. Die-embedded glass interposer with minimum warpage for 5G/6G applications [C]// 2023 IEEE 73rd Electronic Components and Technology Conference (ECTC), 2023: 2247-2254.

[20] [20] Ravichandran S, Kathaperumal M, Swaminathan M, et al. Large-body-sized glass-based active interposer for high-performance computing [C]// 2020 IEEE 70th Electronic Components and Technology Conference (ECTC), 2020: 879-884.

[21] [21] Yang L, Wang K, Wang B, et al. 3-D glass integrated stacked patch antenna array for silicon active package system [J]. IET Microwaves, Antennas & Propagation, 2024, 18(4): 239-247.

[22] [22] Fang Z, Zhang J, Gao L, et al. Absorptive filtering packaging antenna design based on Through-Glass Vias [J]. IEEE Transactions on Components, Packaging and Manufacturing Technology, 2023, 13(11): 1817-1824.

[23] [23] Su Y, Yu D, Ruan W, et al. Development of compact millimeter-wave antenna by stacking of five glass wafers with Through Glass Vias [J]. IEEE Electron Device Letters, 2022, 43(6): 934-937.

[24] [24] ur Rehman M, Ravichandran S, Erdogan S, et al. W-band and D-band transmission lines on glass based substrates for sub-THz modules [C]//2020 IEEE 70th Electronic Components and Technology Conference (ECTC), 2020: 660-665.

[25] [25] Yu T, Xue K, Li K, et al. Characteristics of 10~110 GHz transmission lines on fused silica substrate for millimeter-wave modules [C]// 2021 22nd International Conference on Electronic Packaging Technology (ICEPT), 2021: 1-5.

[26] [26] Cai J, Zhang M, Yu C, et al. An air-filled double-sided gap waveguide based on glass packaging for mm-W applications [J]. IEEE Microwave and Wireless Technology Letters, 2024, 34(3): 275-278.

[27] [27] ur Rehman M, Watanabe A, Ravichandran S, et al. Substrate integrated waveguides in glass interposers for mm wave applications [C]// 2021 IEEE MTT-S International Microwave Symposium (IMS), 2021: 339-341.

[28] [28] ur Rehman M, Kumar L N V, Erdogan S, et al. Air filled SIWs using laminate dielectrics on glass substrate for D-band applications [J]. IEEE Transactions on Components, Packaging and Manufacturing Technology, 2024, 14(1): 98-105.

[29] [29] Shah U, Liljeholm J, Campion J, et al. Low-loss, high-linearity RF interposers enabled by Through Glass Vias [J]. IEEE Microwave and Wireless Components Letters, 2018, 28(11): 960-962.

[30] [30] Galler T, Chaloun T, Krhnert K, et al. Hermetically sealed glass package for highly integrated MMICs [C]// 2019 49th European Microwave Conference (EuMC), 2019: 292-295.

[31] [31] Galler T, Chaloun T, Mayer W, et al. MMIC-to-dielectric waveguide transitions for glass packages above 150 GHz [J]. IEEE Transactions on Microwave Theory and Techniques, 2023, 71(7): 2807-2817.

[32] [32] Psychogiou D, Ashley A. Glass-based bandpass filters for new radio (NR) K-/Ka-band communications [J]. IEEE Transactions on Components, Packaging and Manufacturing Technology, 2022, 12(5): 887-889.

[33] [33] Galler T, Schulz-Ruhtenberg M, Chaloun T, et al. Mechanically flexible dielectric waveguides and bandstop filters in glass technology at G-band [C]// 2022 52nd European Microwave Conference (EuMC), 2022: 294-297.

[34] [34] Bartlett C, Malav A, Letz M, et al. Structured-glass waveguide technology for high-performance millimetre-wave components and systems [J]. IEEE Journal of microwaves, 2022, 2(2): 307-315.

[35] [35] Ma H, Hu Z, Yu D. A low-loss bandpass filter with stacked double-layer structure using glass-based integrated passive device technology [J]. IEEE Electron Device Letters, 2023, 44(7): 1216-1219.

[36] [36] Wang D, Polat E, Tesmer H, et al. Highly miniaturized continuously tunable phase shifter based on liquid crystal and defected ground structures [J]. IEEE Microwave and Wireless Components Letters, 2022, 32(6): 519-522.

[37] [37] Panahi M A, Yeung L, Hedayati M, et al. Sub-6 GHz high FOM liquid crystal phase shifter for phased array antenna [J]. IEEE Journal of Microwaves, 2022, 2(2): 316-325.

[38] [38] Erdogan S, Moon K S J, Kathaperumal M, et al. D-band integrated and miniaturized quasi Yagi antenna array in glass interposer [J]. IEEE Transactions on Terahertz Science and Technology, 2023, 13(3): 270-279.

[39] [39] Xu J, Lin S, Huang Y, et al. Design of patch antenna array with cavity structure on quartz glass for radar applications [C]//2022 IEEE 9th International Symposium on Microwave, Antenna, Propagation and EMC Technologies for Wireless Communications (MAPE), 2022: 208-211.

[40] [40] Galler T, Frey T, Waldschmidt C, et al. High-gain millimeter-wave holographic antenna in package using glass technology [J]. IEEE Antennas and Wireless Propagation Letters, 2020, 19(12): 2067-2071.

[41] [41] Naqvi A H, Park J H, Baek C W, et al. V-band end-fire radiating planar micromachined helical antenna using Through-Glass Silicon Via (TGSV) technology [J]. IEEE Access, 2019, 7: 87907-87915.

[42] [42] Fang Z, Zhang J, Gao L, et al. Ka-band broadband filtering packaging antenna based on Through-Glass Vias (TGVs) [J]. Frontiers of Information Technology & Electronic Engineering, 2023, 24(6): 916-926.