Progress on the Application of Glass in RF System Packaging and RF Components

Semiconductor Optoelectronics, Volume. 45, Issue 6, 861(2024)

WU Lei^1,2

Author Affiliations

¹The 10th Research Institute of China Electronics Technology Corporation, Chengdu 610036, CHN

²Sichuan Engineering Technology Research Center for Electricity Interconnect of Electronic Information Equipment, Chengdu 610036, CHN

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WU Lei. Progress on the Application of Glass in RF System Packaging and RF Components[J]. Semiconductor Optoelectronics, 2024, 45(6): 861

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Received: May. 20, 2024

Accepted: Feb. 28, 2025

Published Online: Feb. 28, 2025

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