In the future, wireless communication systems will deploy higher frequency bands to meet their development needs, such as high performance, miniaturization, and diversification. Radio frequency (RF) technology constitutes the foundation for the implementation of wireless communication systems and directly determines the performance of the entire communication system. Glass exhibits an excellent high-frequency electrical performance and high stability. As surface high-density forming technology for fine metal wire and high-reliability processing technology for large aspect ratio through hole continue to evolve, glass is gradually finding wide application as a substrate material for advanced packaging of RF systems and passive RF components. This article provides a systematic overview of the latest progress in the research on the applications of glass in three RF packaging technologies: chip back loading, chip embedding, and 3D stacking, as well as five passive RF components: transmission lines, interconnect lines, filters, phase shifters, and antennas. Different advanced packaging structures and passive RF components are analyzed from the perspectives of structural integration, process feasibility, and RF performance, along with the corresponding challenges. Finally, directions for the development of glass-based RF systems in the future is discussed from the aspects of optoelectronic co-packaging, SOP integration, and efficient heat dissipation.