Study On Optical Communications, Volume. 49, Issue 1, 1(2023)

Silicon Photonic 2.5D/3D Integration Technology and Its Applications

Xiang-peng OU... Zai-li YANG, Bo TANG, Zhi-hua LI, Jun LUO, Wen-wu WANG and Yan YANG* |Show fewer author(s)
Author Affiliations
  • Integrated Circuit Advanced Process R&D Center, Institute of Microelectronics of Chinese Academy of Sciences, Beijing 100029, China
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    Figures & Tables(13)
    Application of silicon-based photonics
    The number of photonic components integrated in a single PIC on three different platforms over time[22]
    Development trend of silicon-based photonic integration technology
    Silicon-based photonic integration structure
    2D integrated silicon-based photonic chip
    High-speed integrated silicon optical transceiver chip
    2.5D integrated silicon photonic chip
    3D integrated silicon photonic chip
    Monolithically integrated silicon photonic chip
    Silicon photonic LiDAR based on OPA
    Silicon photonic neural network chip
    Sensors based on silicon-based optoelectronic platform
    • Table 1. Silicon photonic chips based on four different integration technologies for communication

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      Table 1. Silicon photonic chips based on four different integration technologies for communication

      集成方式技术成熟度单通道速率/Gbit/s调制格式通道数尺寸功耗调制器类型参考文献
      2D25.0NRZ88 mm×12 mmTotal~2W,TXMZM[43]
      25.0NRZ5N/A5.34 pJ/bit, TXMRM[44]
      112.0PAM41N/A6.00 pJ/bit, TXMRM[45]
      1.6 Tbit/sPAM48N/AN/AMZM[21]
      2.5D50.0NRZ414 mm×8.5 mmN/AMZM[38]
      200.0QAM121.6 mm×13 mmTotal~4.9 WMZM[75]
      200.0PAM4128N/AN/AMZM[76]
      3D56.0NRZ24 mm×8 mm11.20 pJ/bitMZM[59]
      30NRZ1N/AN/AMZM[37]
      25.0NRZ1610 mm×11 mm5.91 pJ/bitMZM[60]
      100.0PAM44N/AN/AMZM[67]
      16.0N/A640.40 mm2 (Si area)N/AMDM[61]
      Monolithic10.0 NRZ4N/A65.50 pJ/bitMZM[72]
      2.50 NRZ42.9 mm×2.9 mm1.23 pJ/bit, TXMRM[77]
      25.0NRZ4N/A14.60 pJ/bitMZM[78]
      10.0NRZ10.015 mm2(Si area)1.91 pJ/bitMRM[74]
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    Xiang-peng OU, Zai-li YANG, Bo TANG, Zhi-hua LI, Jun LUO, Wen-wu WANG, Yan YANG. Silicon Photonic 2.5D/3D Integration Technology and Its Applications[J]. Study On Optical Communications, 2023, 49(1): 1

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    Paper Information

    Category: Research Articles

    Received: Oct. 21, 2022

    Accepted: --

    Published Online: Feb. 15, 2023

    The Author Email: YANG Yan (yyang10@ime.ac.cn)

    DOI:10.13756/j.gtxyj.2023.01.001

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