Journals Articles Conferences News About CLP
Submit a paper Email Alert
Search
Search
Articles
Journals
News
Advanced Search
Top Searches
2D MaterialsTransformation opticsQuantum PhotonicsSmall lasersSemiconductor UV PhotonicsSupersymmetric microring laser arrays

Piezoelectrics & Acoustooptics, Volume. 42, Issue 3, 361(2020)

Study on Wafer Bonding Technology of SAW Devices

LU Dandan, MI Jia, PENG Xingwen, TAN Xinyi, and JIN Zhong
Author Affiliations
  • [in Chinese]
    • show less
    AbstractGet PDF(in Chinese)
    Figures&Tables (0)
    Equations (0)
    References (1)
    Tools
    Paper Information
    Topics
    References(1)

    [2] [2] TAKIGAWA R, UTSUMI J. Direct bonding of LiNbO3 and SiC wafers at room temperature［J］. Scripta Materialia, 2020: 174.

    Tools

    Get Citation

    Copy Citation Text

    LU Dandan, MI Jia, PENG Xingwen, TAN Xinyi, JIN Zhong. Study on Wafer Bonding Technology of SAW Devices[J]. Piezoelectrics & Acoustooptics, 2020, 42(3): 361

    Download Citation

    EndNote(RIS)BibTexPlain Text
    Set citation alerts for article
    Save article for my favorites
    Paper Information

    Received: Mar. 11, 2020

    Accepted: --

    Published Online: Apr. 21, 2022

    The Author Email:

    DOI:10.11977/j.issn.1004-2474.2020.03.018

    Topics

    laser devices and laser physics
    Lasers and Laser Optics
    Laser physics
    laser manufacturing
    Instrumentation, Measurement and Metrology