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Piezoelectrics & Acoustooptics, Volume. 42, Issue 3, 361(2020)

Study on Wafer Bonding Technology of SAW Devices

LU Dandan... MI Jia, PENG Xingwen, TAN Xinyi and JIN Zhong |Show fewer author(s)
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    LU Dandan, MI Jia, PENG Xingwen, TAN Xinyi, JIN Zhong. Study on Wafer Bonding Technology of SAW Devices[J]. Piezoelectrics & Acoustooptics, 2020, 42(3): 361

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    Paper Information

    Received: Mar. 11, 2020

    Accepted: --

    Published Online: Apr. 21, 2022

    The Author Email:

    DOI:10.11977/j.issn.1004-2474.2020.03.018

    Topics

    laser devices and laser physics
    Lasers and Laser Optics
    Laser physics
    laser manufacturing
    Instrumentation, Measurement and Metrology