Piezoelectrics & Acoustooptics, Volume. 42, Issue 3, 361(2020)
Study on Wafer Bonding Technology of SAW Devices
The fabrication of composite single crystal film and the use of wafer-level packaging are needed with the development of surface acoustic wave devices toward miniaturization, integration and higher performance. In this paper, the key process of wafer bonding is studied, and the process requirements are proposed. The key process requirements and equipment characteristics are briefly described, and the metal bonding process is verified. The experiment shows that both the equipment and process can meet the product packaging requirements.
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LU Dandan, MI Jia, PENG Xingwen, TAN Xinyi, JIN Zhong. Study on Wafer Bonding Technology of SAW Devices[J]. Piezoelectrics & Acoustooptics, 2020, 42(3): 361
Received: Mar. 11, 2020
Accepted: --
Published Online: Apr. 21, 2022
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