Microelectronics, Volume. 54, Issue 2, 304(2024)
Design Processing and Reliability Evaluation of Ceramic Shells under High Temperatures and Pressures
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LIU Wenhui. Design Processing and Reliability Evaluation of Ceramic Shells under High Temperatures and Pressures[J]. Microelectronics, 2024, 54(2): 304
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Received: Aug. 24, 2023
Accepted: --
Published Online: Aug. 21, 2024
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