Microelectronics, Volume. 54, Issue 2, 304(2024)

Design Processing and Reliability Evaluation of Ceramic Shells under High Temperatures and Pressures

LIU Wenhui1,2
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  • 2[in Chinese]
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    LIU Wenhui. Design Processing and Reliability Evaluation of Ceramic Shells under High Temperatures and Pressures[J]. Microelectronics, 2024, 54(2): 304

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    Paper Information

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    Received: Aug. 24, 2023

    Accepted: --

    Published Online: Aug. 21, 2024

    The Author Email:

    DOI:10.13911/j.cnki.1004-3365.230499

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