Journal of Terahertz Science and Electronic Information Technology , Volume. 22, Issue 3, 331(2024)

A T/R module based on silicon-based MEMS 3D integration technology

CHEN Xing*... ZHANG Chao, LI Xiaolin and ZHAO Yongzhi |Show fewer author(s)
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    References(4)

    [3] [3] YEO S K, CHUN J H, KWON Y S. A 3D X-band T/R module package with an anodized aluminum multilayer substrate for phased array radar applications[J]. IEEE Transactions on Advanced Packaging, 2010,33(4):883-891.

    [4] [4] LIU Enda, WU Hongjiang, ZHAO Yongzhi. Design of phased array T/R component microsystem based on heterogeneous integration technology[J]. Journal of Physics: Conference Series, 2019(1325):012010. doi:10.1088/1742-6596/1325/1/012010.

    [5] [5] LUCERO R, QUTTENEH W, PAVIO A, et al. Design of an LTCC switch diplexer front-end module for GSM/DCS/PCS applications[C]// 2001 IEEE Radio Frequency Integrated Circuits(RFIC) Symposium. Phoenix: IEEE, 2001: 213-216. doi: 10.1109/RFIC.2001.935678.

    [9] [9] ZHAO Yongzhi,WANG Shaodong,WU Hongjiang. A novel dual channel receive front-end module with MEMS technology[C]// 2018 IEEE International Symposium on Electromagnetic Compatibility and 2018 IEEE Asia-Pacific Symposium on Electromagnetic Compatibility. Suntec City:IEEE, 2018:674-677. doi:10.1109/ISEMC.2018.8393866.

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    CHEN Xing, ZHANG Chao, LI Xiaolin, ZHAO Yongzhi. A T/R module based on silicon-based MEMS 3D integration technology[J]. Journal of Terahertz Science and Electronic Information Technology , 2024, 22(3): 331

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    Paper Information

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    Received: Jul. 28, 2023

    Accepted: --

    Published Online: Aug. 14, 2024

    The Author Email: Xing CHEN (ccyt9837@sohu.com)

    DOI:10.11805/tkyda2023208

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