Journal of Terahertz Science and Electronic Information Technology , Volume. 22, Issue 3, 331(2024)
A T/R module based on silicon-based MEMS 3D integration technology
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CHEN Xing, ZHANG Chao, LI Xiaolin, ZHAO Yongzhi. A T/R module based on silicon-based MEMS 3D integration technology[J]. Journal of Terahertz Science and Electronic Information Technology , 2024, 22(3): 331
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Received: Jul. 28, 2023
Accepted: --
Published Online: Aug. 14, 2024
The Author Email: Xing CHEN (ccyt9837@sohu.com)