[1] [1] CUI J F,ZHAO J, FAN ZH W, et al.. Study on LD-pumped Nd :YAG laser cutter for silicon wafer ［J］. Opt.Precision Eng.，2006，14(5)：829-834.(in Chinese)

[2] [2] WU D J, ZHAN G Q, GUO D M. Experiment on bending of Al2O3 ceramic slice with CO2 CW-laser ［J］. Opt. Precision Eng.，2009，17(10)：2437-2476. (in Chinese)

[3] [3] WANG X Y, XU W X, XU W J, et al.. Simulation and experiment of laser bending of silicon sheet ［J］. Opt. Precision Eng.，2008，16(4)：606-610. (in Chinese)

[4] [4] TRIANTAFYLLIDIS D. Dual laser beam modification of high alumina ceramics ［J］.Journal of Laser Application，2003,15(1):49-54.

[5] [5] LUMLEY R M. Controlled separation of brittle materials using a laser ［J］. American Ceramic Society Bulletin, 1969,48:850-854.

[6] [6] TSAI CH H, CHEN H W. Laser cutting of thick ceramic substrates by controlled fracture technique［J］. Journal of Materials Technology, 2003,136:166-173.

[7] [7] JUNKE J,WANG X B. A simulation of machining glass by dual CO2-laser beams ［J］. Optics＆Laser Technology, 2008, 40:297-301.

[8] [8] KONDRA T. Method of splitting non-metallic materials: U S, 5609284 ［P］. 1997.

[9] [9] BLACK I,CHUA K L. Laser cutting of thick ceramic tile ［J］. Optics＆Laser Technology, 1997,29:193-205.

[10] [10] SALMAN N,SHEIKH M A, LI L,et al.. Effect of thermal stress on chip-free diode laser cutting of glass ［J］. Optics＆Laser Technology, 2009,41:318-327.

[11] [11] SHEN ZH, ZHANG SY, LU J, et al.. Mathematical modeling of laser induced heating and melting in solid ［J］. Optics＆Laser Technology，2001,33:533-537.

[12] [12] CHEN Y B,LU J,NI X W. Analysis of thermal stress damage in single-crystal silicon induced by 1 064 nm long-pulse laser［J］. SPIE, 2007,6835:68351x.

[13] [13] ZHU X K, CHAO Y J. Numerical simulation of transient temperature and residual stress in friction stir welding of 304L stainless steel ［J］. Journal of Materials Processing Technology, 2004,146:263-272.

[14] [14] YAMADA K,UEDA T,HOSOKAWA A,et al.. Thermal damage of silicon wafer in thermal cleaving process with pulsed laser and CW laser ［J］.SPIE, 2006,6107:61070H.

[15] [15] UEDA T,YAMADA K,OISO K,et al.. Thermal stress cleaving of brittle material by laser beam ［J］. CIRP Annals-Manufacturing Technology, 2002,51(1):149-152.