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Optics and Precision Engineering, Volume. 19, Issue 2, 414(2011)

Fracture behavior during pulsed laser irradiating silicon wafer

LIU Jian*... LU Jian, NI Xiao-wu, DAI Gang and ZHANG Liang |Show fewer author(s)
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    LIU Jian, LU Jian, NI Xiao-wu, DAI Gang, ZHANG Liang. Fracture behavior during pulsed laser irradiating silicon wafer[J]. Optics and Precision Engineering, 2011, 19(2): 414

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    Paper Information

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    Received: Oct. 8, 2010

    Accepted: --

    Published Online: Mar. 30, 2011

    The Author Email: Jian LIU (liujiannjlg@yahoo.com.cn)

    DOI:

    CSTR:32186.14.

    Topics

    laser devices and laser physics
    Lasers and Laser Optics
    Laser physics
    laser manufacturing
    Instrumentation, Measurement and Metrology