Journal of Semiconductors, Volume. 45, Issue 7, 072501(2024)

Current-collapse suppression and leakage-current decrease in AlGaN/GaN HEMT by sputter-TaN gate-dielectric layer

Bosen Liu1,2, Guohao Yu2,3, Huimin Jia1, Jingyuan Zhu1, Jiaan Zhou2, Yu Li2, Bingliang Zhang3, Zhongkai Du3, Bohan Guo2, Lu Wang1, Qizhi Huang2, Leifeng Jiang2, Zhongming Zeng2, Zhipeng Wei1、*, and Baoshun Zhang2、**
Author Affiliations
  • 1State Key Laboratory of High-Power Semiconductor Laser, School of Physics, Changchun University of Science and Technology, Changchun 130022, China
  • 2Nanofabrication facility, Suzhou Institute of Nano-Tech and Nano-Bionics, Chinese Academy of Sciences, Suzhou 215123, China
  • 3Suzhou Powerhouse Electronics Technology Co., Ltd., Suzhou 215123, China
  • show less
    References(35)
    Tools

    Get Citation

    Copy Citation Text

    Bosen Liu, Guohao Yu, Huimin Jia, Jingyuan Zhu, Jiaan Zhou, Yu Li, Bingliang Zhang, Zhongkai Du, Bohan Guo, Lu Wang, Qizhi Huang, Leifeng Jiang, Zhongming Zeng, Zhipeng Wei, Baoshun Zhang. Current-collapse suppression and leakage-current decrease in AlGaN/GaN HEMT by sputter-TaN gate-dielectric layer[J]. Journal of Semiconductors, 2024, 45(7): 072501

    Download Citation

    EndNote(RIS)BibTexPlain Text
    Save article for my favorites
    Paper Information

    Category: Articles

    Received: Jan. 22, 2024

    Accepted: --

    Published Online: Jul. 18, 2024

    The Author Email: Wei Zhipeng (ZPWei), Zhang Baoshun (BSZhang)

    DOI:10.1088/1674-4926/24010025

    Topics