Journal of Semiconductors, Volume. 45, Issue 7, 072501(2024)
Current-collapse suppression and leakage-current decrease in AlGaN/GaN HEMT by sputter-TaN gate-dielectric layer
Fig. 1. (Color online) (a) Schematic of AlGaN/GaN HEMT with different gate dielectric layers. Logarithmic coordinate transformation curve of (b) Sample A, (c) Sample B. (d) Results of other reported works on leakage current.
Fig. 2. (Color online) (a) XPS valence band spectra of GaN and TaN. (b) N 1s core-level spectra of TaN. (c) Band offset between TaN and GaN.
Fig. 3. (Color online) (a) The gate leakage curve of two samples. (b) TaN or Al2O3 as gate dielectric layer for MIS HEMT device breakdown voltage curve.
Fig. 4. (Color online) (a) The current collapse effect curve of two samples; (b) chamber environment of medium deposition using magnetron sputtering.
Fig. 5. (Color online) C−V measurement at 1 MHZ frequency of two samples.
Fig. 6. (Color online) (a) The pulse mode ID−VGS measurements of Sample A and Sample B are presented. (b) The interface trap charge density Qit is determined for all samples with ∆E > x (eV).
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Bosen Liu, Guohao Yu, Huimin Jia, Jingyuan Zhu, Jiaan Zhou, Yu Li, Bingliang Zhang, Zhongkai Du, Bohan Guo, Lu Wang, Qizhi Huang, Leifeng Jiang, Zhongming Zeng, Zhipeng Wei, Baoshun Zhang. Current-collapse suppression and leakage-current decrease in AlGaN/GaN HEMT by sputter-TaN gate-dielectric layer[J]. Journal of Semiconductors, 2024, 45(7): 072501
Category: Articles
Received: Jan. 22, 2024
Accepted: --
Published Online: Jul. 18, 2024
The Author Email: Wei Zhipeng (ZPWei), Zhang Baoshun (BSZhang)